Wafer Inspection Tool
-- Semiconductor International, 1/1/2008
AW200 Series C-SAM is an acoustic micro imaging system that performs automated inspection, analysis and sorting of bonded wafers up to 200 mm. It pairs wafers with the company's Waterfall transducer and, after imaging, each wafer is automatically dried. The system is capable of detecting inter-wafer voids as small as 5 μm and as thin as 0.02 μm. Sonoscan Inc. , Elk Grove Village, Ill., www.sonoscan.com
