Wafer Cleaning System
-- Semiconductor International, 4/1/2008
Da Vinci Prime is an upgraded version of the Da Vinci single-wafer wet cleaning tool. The tool is considered to have a "dual use" in that it can handle very demanding back-end-of-line (BEOL) applications, as well as less-demanding front-end-of-line (FEOL) applications. It is available in two configurations: one with a single front-end robot (max. throughput, 250 wph) or a dual front-end robot for "ideal" process (max. throughput, 350 wph). SEZ Group, Villach, Austria, www.sez.com
