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	Attend this conference to gain critical insights on Market Impacts and Analysis End-user Perspectives 3-D Integration and Packaging Technologies Design Methodology and Tools Manufacturing Issues and Solutions
	Targeting senior-level technologists and business managers from the world's leading companies and research institutions, and addresses the interests of a diverse group: Semiconductor fabs and packaging houses Equipment and materials suppliers Device designers Electronic systems producers Investment and business development advisors Electronic design automation vendors End-users and merchant foundaries University, government and related research programs Investment advisers and industry analysts

After years of emergent growth and interest, the far-reaching reality of 3-D integration and packaging is settling in across the semiconductor industry. Only a few years ago the topic of 3-D was only occasionally mentioned in industry publications or gatherings, and now the topic seems to be pervasive, seemingly covered everywhere, all the time. The various performance, size, and cost drivers to the move toward 3-D are well known, at least in a general sense. Likewise, the various routes and options for implementation of 3-D, whether it be through front-end manufacturing or in packaging, are often discussed. Of course this also means near-term market opportunities are recognized as well. Regardless of this expanding reality, the situation continues to be very dynamic as technology continues to evolve. Many technical and cost challenges remain, including design, wafer process and handling, via processing, test, yield, thermal, standards, and so on. Furthermore there is an increasing need to understand the cost and performance picture for specific end-use products, to help define opportunity and drive further development. The interest in 3-D approaches is well founded-3-D integration and packaging presents both a threat and an opportunity to each industry player along the supply chain-threats and opportunities that are still not well understood. The best path forward, whether from a technology or market standpoint, often remains uncertain.

If you have questions about the upcoming event, please contact Matt Mecray at 207.829.6084 or by e-mail at mmecray@rti.org. For more information on the Technology Venture Forum Series Review the goals and objectives Browse through materials from our previous forums