EV Group, EVG520IS Semi-Automated Wafer Bonding System
The EVG520IS single-chamber unit handles wafers up to 200 mm with semi-automated operation for small volume production applications. Redesigned based on customer...
EV Group, Gemini Automated Production Wafer Bonder
A maximum level of automation and process integration is achieved by the Gemini. Wafer-to-wafer alignment and wafer bonding processes up to 300 mm for volume MEMS...
Advanced packaging uses photolithographic processes to perform IC packaging at wafer level. The IQ Aligner has universal features suitable for wafer bumping, chip...