22.11.2008

Welcome to SMT/HYBRID/PACKAGING 2009 - Europe's no.1 special interest event for System Integration in Micro Electronics!

Traditionally the SMT/HYBRID/PACKAGING forms the ideal platform for the industry's leading companies. Among other things the show presents the latest trends and developments as well as up-to-date solutions. With foreign companies accounting for 33% of the exhibitors, the event offers not only a wide, but also an international spectrum. And you too, can benefit from the success of this well-established event! The highly qualified audience from over 50 countries rated the exhibition extremely positively.

From design and development to PCB production, components, packaging and test systems - SMT/HYBRID/PACKAGING offers a comprehensive and compact presentation of products all under one roof!

Opening Hours & Dates

Tuesday, 05.05.2009  09:00-17:00 hrs
Wednesday, 06.05.2009  09:00-17:00 hrs
Thursday, 07.05.2009  09:00-17:00 hrs

Frequency: annual

Further editions:
8 June 2010 - 10 June 2010

Exhibition Fees

With entry voucher:
free of charge 
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With pre-registration:
free of charge
pfeil_link.gifpre-register online

Regular tickets: 
Season ticket 44,00 EUR
One-day ticket 22,00 EUR
Students 50% off

Free access to exhibition for conference attendees.

Venue

Messezentrum Nuremberg
Karl-Schönleben-Straße
90471 Nuremberg

Organizer

Mesago Messe Frankfurt GmbH
Rotebuehlstr. 83-85
70178 Stuttgart
Germany
Tel. +49 711 61946-0
Fax +49 711 61946-93

Committee Chairman

Prof. Dr. Herbert Reichl, Technische Universität Berlin / Fraunhofer Institut für Zuverlässigkeit und Mikrointegration, Berlin

US Agency

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MyAccount

Personal Exhibition Planner

For an overview of the operation and the features of our electronic exhibition planner

click here!


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