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ON Semi lays off 1500, closes plants, forces unpaid time off
ON Semiconductor makes deep cuts to its workforce, capital expenditures, manufacturing operations, and employee compensation that it expects will reduce total fixed costs by up to $50 million a quarter and will help it navigate the continuingly challenging economic climate.

Asyst to Lay Off 15% of Its Workforce
Asyst Technologies Inc. said it will reduce its workforce by ~15% by the end of March, part of an effort to cut annual costs by $30M-$35M. CEO Steve Schwartz outlined other moves the company is making to reduce overhead, and said the company is focused on “on our most critical new products and customer relationships.”

Samsung Electronics Orders Zeiss Mask Metrology System
Samsung Electronics ordered a mask metrology tool from Carl Zeiss SMT, the second company to order the PROVE system following an order last month from NuFlare Technology, the leading mask writer vendor. The tool uses 193 nm imaging optics to measure masks used in immersion and EUV scanners.

IITC Set for Sapporo in June, Europe in 2011
The International Interconnect Technology Conference (IITC) will move from its traditional venue near the San Francisco airport to Sapporo, Japan, in early June. The conference will focus on 3-D technologies, packaging and system integration, novel materials and interconnect systems, and environmental issues, among others.

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News from the Web

RF Micro Devices cuts capex to US$20 million for 2009
Source: www.fabtech.org
Date: 4 minutes ago
3G, cellular modems to sustain mobile device growth
Source: www.eetimes.eu
Date: 4 hours 2 minutes ago
Samsung Electronics Orders Photomask Metrology System From Carl Zeiss
Source: www.nanowerk.com
Date: 6 hours 15 minutes ago
SiGe SE2568U ISM band power amplifier
Source: www.electronicsweekly.com
Date: 9 hours 52 minutes ago

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Wafer Processing Lanthanum Doping May Boost Silicon FETs Elpida in Talks With Taiwan DRAM Makers Flash Vendors Facing Scaling Challenges View All Stories	Lithography Photronics Quarterly and Annual Revenue Up Slightly IEDM Panel: Processing Costs Headed Up NuFlare Orders Zeiss Mask Metrology Tool View All Stories
Yield Management Foundries, High-k on Program at International Reliability Physics Symposium TI Blitzes to Improve Fab Productivity ISMI Outlines 450 mm Wafer, NGF Roadmaps View All Stories	Inspection, Measurement & Test Foundries, High-k on Program at International Reliability Physics Symposium IEDM Panel: Processing Costs Headed Up Multitest to Merge with Everett Charles Technologies View All Stories
Clean Processing Ulvac Enables Flexible Li-Ion Battery Ulvac Readies Resist Residue Removal Tool Fab ESH: Prepare Better, Minimize Impact View All Stories	Materials Carbone Lorraine Acquires Calcarb in Solar Push Lanthanum Doping May Boost Silicon FETs Flash Vendors Facing Scaling Challenges View All Stories

News from Lexis Nexis

Varian Doubles Loss Forecast, Plans Week-Long Shutdown

iSuppli Says DRAM Vendors Face Futher Cutbacks

HelioVolt Makes "Modest" Reduction in Staff

Blogs
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Podcast
Video

PERSPECTIVES FROM THE LEADING EDGE
Philip Garrou, Consultant,
January 8, 2009
3D Integration Highlights of the 2008 MRS contd.
Continuing to update recent work from the 2008 MRS in Boston……&hellip...
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The Measure of All Things
Alexander E. Braun, Senior Editor, Semiconductor International
January 7, 2009
Of Sand and Power
No one will argue against the necessity of applying every known (and developing) sour...
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VIEWS ON NEWS
David Lammers, News Editor, Semiconductor International
December 15, 2008
IEDM and the Intel Replacement Gate Update
Already, rumors are swirling at the 2008 International Electron Device Meeting, which...
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FLOAT ZONE
Laura Peters, Editor-in-Chief, Semiconductor International
September 26, 2008
Halla’s Perfect Storm of Technology Neglect
Back in 2005, I sat in on a great keynote speech by Brian Halla, CEO and President of...
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very interesting. incredible forensic/reverse engineering work....
Barack Shockley - 1/4/2009 2:32:31 PM PT
in response to Physical Analysis Provides Images of 45 nm

The leading-edge logic processes presented at 2008 IEDM can be looked at SOI vs Bulk....
sang kim, Ph.D - 1/2/2009 1:27:37 PM PT
in response to Leading-Edge Logic Processes Presented at IEDM Session

Secondary electrons defeat SPF purpose. You figure everyone should know this by now. ...
Guest - 12/30/2008 7:57:49 PM PT
in response to Advancements in EUV Optics Technology

I think crosstalk between adjacent cells is more constraining than actual size. For e...
NVMTS attendee - 12/23/2008 6:13:55 PM PT
in response to Flash Vendors Facing Scaling Challenges

» VIEW ALL TALKBACK THREADS

EDA Supports Mask Development and Continuing Shrinks
Aart de Geus, Synopsys

Professor Describes Unipolar CMOS Proposal
T.P Ma, Yale University

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