The latest news and information on MEMS manufacturing, including microelectromechanical systems, RF-MEMS and MOEMS.
Tegal Acquires Alcatel Micro Machining Systems in DRIE Move Aimed at TSVs David Lammers, News Editor - 09/03/2008
Tegal Corp. said it will acquire product lines from Alcatel Micro Machining Systems, giving it a deep reactive ion etch (DRIE) capability for through silicon vias (TSVs). “This acquisition is really the key piece of our product strategy that has been missing for a couple of years,” said Tegal CEO Thomas Mika. More
Global Conditions Dampen Europa Laura Peters, Editor-in-Chief - 10/13/2008
Much of the focus of last week’s SEMICON Europa show was on keeping European companies competitive in the semiconductor, solar, MEMS and related industries. Although the AMD/Abu Dhabi announcement did much to boost this concept, a dark cloud caused by the global economic conditions hung over the show in Stuttgart, Germany.
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MEMS: Tremendous Potential, Packages Taking Shape Ken Gilleo, ET-Trends LLC, Warwick, R.I. - 08/01/2008
MEMS are poised to become the most important technology of the 21st century, but only if packaging issues can be resolved. Substantial progress continues in the key areas of lower-cost ceramics, molded plastic cavities and wafer-level packaging.
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Yole Updates 2007 MEMS Ranking Staff - 07/02/2008
Yole Dévelopement updated its 2007 ranking of the 30 largest MEMS suppliers, adding Sanyo Electric to the list. With 2007 sales of $5.6B, the 30 largest companies account for an estimated 80% of the global MEMS market.
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Leveraging Novel MEMS Technologies for Next-Generation Photovoltaic Applications Paul Lindner, Executive Technology Director, EV Group, St. Florian/Inn, Austria, www.evgroup.com - 07/01/2008
Cross-industry innovation involves creative imitation in the course of a radical innovation process. This article discusses a successful application of technology from the MEMS industry to the photovoltaics industry.
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WLP Could Transform MOEMS, MEMS Herwig Kirchberger, EV Group, St. Florian, Austria - 04/01/2008
True wafer-level packaging could dramatically reduce the cost of M(O)EMS manufacturing. MOEMS packages require optical transparency at the operating wavelength of the individual sensors and actuators, in addition to the conventional packaging requirements of MEMS.
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Strong Sensor, Actuator Market Driven By MEMS Technologies David Lammers, News Editor - 03/27/2008
MEMS technology is driving new applications, making sensors and actuators the fastest growing part of the overall semiconductor industry, according to IC Insights Inc. Overall growth of the chip industry is expected to be healthy over the next five years, with an 12% CAGR driven by improving ASPs.
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Yole Ranks Top 30 MEMS Suppliers; Sees Rapid Growth in Consumer, Medical Staff - 01/31/2008
Yole Développement, (Lyon, France), a market research firm specializing in MEMS, packaging and related markets, released its 2007 ranking of the top 30 MEMS manufacturers. The market research firm also broke out the fastest-growing MEMS applications, with consumer and medical fluidics markets showing particularly fast growth.
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MEMS: Tremendous Potential, Packages Taking Shape Ken Gilleo, ET-Trends LLC, Warwick, R.I., 08/01/2008
MEMS are poised to become the most important technology of the 21st century, but only if packaging issues can be resolved. Substantial progress continues in the key areas of lower-cost ceramics, molded plastic cavities and wafer-level packaging....
Leveraging Novel MEMS Technologies for Next-Generation Photovoltaic Applications Paul Lindner, Executive Technology Director, EV Group, St. Florian/Inn, Austria, www.evgroup.com, 07/01/2008
Cross-industry innovation involves creative imitation in the course of a radical innovation process. This article discusses a successful application of technology from the MEMS industry to the photovoltaics industry....
WLP Could Transform MOEMS, MEMS Herwig Kirchberger, EV Group, St. Florian, Austria, 04/01/2008
True wafer-level packaging could dramatically reduce the cost of M(O)EMS manufacturing. MOEMS packages require optical transparency at the operating wavelength of the individual sensors and actuators, in addition to the conventional packaging requirements of MEMS....
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MEMS: Tremendous Potential, Packages Taking Shape
