QLC-7500 - Online Chemical Monitoring System for Copper Deposition and TSV applications

Quali-Line QLC-7500

The QUALI-LINE QLC-7500 is the new generation of ECI's On-Line, Chemical Monitoring Systems (CMS). QLC-7500 was designed to provide analysis capabilities for Front-End and Back-End plating applications in HVM fabs, while achieving a significant reduction in Cost of Ownership (CoO) compared to the original QLC-7000. The analytical techniques incorporated in QLC-7500, provide metrology solutions to the tightest specifications necessary for the 65nm, 45nm and 32nm nodes.

ECI’s 20 years of experience and leadership in plating bath analysis are captured in the new design.

QLC-7500 incorporates CVS technique for analyzing organic additives and Spectroscopic techniques for non-reagent inorganic analysis. This combination minimizes preparation requirements and allows for simultaneous analyses. Moreover, reduction of chemical reagents drastically decreases maintenance and waste generation while increasing overall system efficiency and reliability.

QLC-7500 introduces a new software platform which enhances user friendliness, modularity and supports all the latest proprietary techniques incorporated in the tool.

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Significant Advancements Lead to Drastic CoO Reduction!