Wafer Bump Inspection System
Staff -- Semiconductor International, 1/1/2008
IBIS-Versalea is a bump inspection system for silicon wafers. It uses conventional interferometry combined with massive parallel data processing to give a production scale inspection tool capable of inspection and reporting on 3000 bumps per second. The system can handle 300 mm wafers and all combinations of substrates in panel format. Lloyd Doyle Ltd., Surrey, UK, www.lloyd-doyle.com
