CMP Endpoint System
-- Semiconductor International, 1/1/2008
The FullVision system enables real-time control of dielectric CMP processes to the 45 nm device node and beyond. The system combines the company's patented window-in-pad technology with multiple-wavelength spectroscopy to deliver advanced in situ endpoint capability for a variety of dielectric materials. It demonstrates high repeatability across all applications with <150 Å, 3σ endpoint accuracy on patterned wafers. Applied Materials Inc., Santa Clara, Calif., www.appliedmaterials.com
