3D All Silicon System Module
Date: March 11-12, 2008
Location: Atlanta, Ga.
The Microsystems Packaging Research Center at Georgia Tech (PRC) in Atlanta, in partnership with IZM-Fraunhofer (Berlin, Germany) and KAIST (Korea), proposes an R&D industry workshop to develop the 3D All Silicon System Module (3DASSM) consortium that will include five major thrusts:
- 3-D silicon system module design for signal, power and electromagnetic shielding
- Ultrahigh-density, fine-pitch silicon substrate with low-cost TSV and multilayer wiring
- Ultrahigh-I/O and reliable IC-to-silicon substrate to board interconnections
- Embedded thin-film actives and passives with improved properties than achieved before
- Advanced thermal solutions
www.prc.gatech.edu/events/3dassm
|
Other Upcoming Events
|
