MagnaChip targeting power apps with backside processes

MagnaChip said its backside processes aim to not only give access to critical technology, but also reduce logistics cost and total cycle time for customers through provision of a one-stop service.

By Ann Steffora Mutschler, Senior Editor -- Electronic News, 6/10/2008

To meet the increasing demand for more comprehensive services from foundry customers and for use in power applications, Seoul, Korea-based analog and mixed-signal semiconductor manufacturer MagnaChip Semiconductor Ltd reported Monday that it has expanded its foundry services to offer backside processes, including 8-inch wafer thinning to 150-micron thickness and backside surface roughness control.

MagnaChip said its backside processes aim to not only give access to critical technology, but to also reduce logistics cost and total cycle time for customers through provision of a one-stop service.

Channy Lee, executive VP and general manager of MagnaChip's semiconductor manufacturing services division, said that the company expects to continually expand its process service portfolio.