Bump/Probe Mark Inspection System
-- Semiconductor International, 7/1/2008
WS 3840 is an inspection and metrology system for bumped wafers and probe marks. It provides 2-D and 3-D bump metrology inspection, such as height, coplanarity and diameter, and bump defect inspection, such as bridging and probe mark inspection. It also ensures that all die are free of damage from the dicing process, enabled by its diced wafer inspection function. All data is gathered and processed in real time, with an optional color review station. Rudolph Technologies Inc., Flanders, N.J., www.rudolphtech.com
