Die Attach Material
-- Semiconductor International, 7/1/2008
Ablestik 8000 series materials were specifically formulated to optimize wafer backside coating processes. The materials are available in conductive (Ablestik 8008) and non-conductive (Ablestik 8008NC) formulations, and have been engineered to address the requirements of smaller die sizes. Ablestik 8008HT is a high thermal adhesive suitable for use in discrete small-power IC devices. Henkel Corp., Irvine, Calif., www.us.henkel.com
