Date: July 28-31, 2008

Location: Shanghai, China

During the past decade, the International Conference on Electronic Packaging Technology (ICEPT) and the International Symposium on High Density Packaging (HDP) have provided a great technical platform for both overseas and domestic academics and industries to exchange ideas in the new developments of electronics packaging. Encouraged by the IEEE-CPMT and other international academic societies, ICEPT and HDP are merged as the International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) this year to meet the requirements of the rapidly developing packaging industry in China. The conference will feature short courses, keynotes and technical sessions to widely cover the technological developments in all the areas of electronics packaging.

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