Packaging Technology
Date: Aug. 3-4, 2008
Location: Tel Aviv, Israel
Semiconductor Packaging Technology is a two-day course that offers detailed instruction on the technology issues associated with today’s semiconductor packages. We place special emphasis on current package technology issues like polymers, lead-free solders, low-k dielectrics, and tools for package analysis. This course is a must for every manager, engineer and technician working in semiconductor packaging, using semiconductor components in high-performance applications or non-standard packaging configurations, or supplying packaging tools to the industry. Participants learn basic but powerful aspects about the semiconductor packaging. This skill-building series is divided into five areas:
- Packaging Technology Overview
- Current Issues
- Materials for Packaging
- Package Reliability and Characterization Techniques
- Future Semiconductor Packages
www.semitracks.com/courses/packaging-tech-course.htm
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