Wafer Edge Cleaning System
-- Semiconductor International, 6/1/2008
Inflexion is a high-precision defect removal system that polishes and cleans the critical wafer edge region. The system polishes the entire wafer edge, removing all film stack residues and shallow surface defects in a single pass while minimizing the exclusion area to maximize the number of good die. It precisely controls the edge profile, which enables users to tailor the film-to-wafer interface to a specified requirement. Inflexion uses the company's Desica single-wafer wet cleaner to ensure defect removal. Abrasive tape with proprietary head technology efficiently removes all materials. Applied Materials Inc., Santa Clara, Calif., www.appliedmaterials.com
