HITACHI ZOSEN'S PROCESSING MACHINE TAKES BIG SUBSTRATE PANELS

Hitachi Zosen Corp. (TSE:7004) has developed a new thin-film laser processing machine that can process panel substrates about 40 per cent longer on a side than in the past.

Solar cells and LCD panels are made by evaporating a conductive material known as indium tin oxide onto a glass substrate and then removing portions of this ITO so that what remains forms circuits.

Hitachi Zosen's research team developed an optical device that can process the material even when the laser light's focal point is moved 3 meters. The result is high-precision processing even on large panels that bend easily. In addition, a device was introduced that blows off the ITO film shavings, which can cause precision to drop.

Furthermore, the table and pillars on which the substrate rests within the machine were strengthened to reduce shaking when moving the substrate. Electronic circuits can thus be etched with a processing error of around 5 microns on substrates 1.4 meters square.

In the past, substrates up to 1 meter square could be processed by thin-film laser processing machines. Increasing the size of the processable panel is expected to boost productivity.

Hitachi Zosen aims to commercialize the machine in the second half of this year.

(Nikkei)