CMP Pad Enhancement
-- Semiconductor International, 6/1/2008
A groove design for the IC1000 AT and VisionPad CMP pads achieves up to 35% reduction in slurry consumption for 200 and 300 mm tungsten polishing processes. It works by improving the slurry delivery to the leading edge of the wafer, and requires less slurry to use. Rohm and Haas Electronic Materials, CMP Technologies, Phoenix, www.rohmhaas.com
