BASF, Evonik to Develop Ceria-Based Slurries
BASF and specialty chemicals provider Evonik Industries AG will collaborate on the development of ceria-based CMP slurries, which are expected to come to market next year.
Staff -- Semiconductor International, 7/3/2008 8:44:00 AM
Two large German chemical companies, giant BASF (Ludwigshafen) and specialty chemicals provider Evonik Industries AG (Essen) said they will collaborate on development of ceria-based chemical mechanical polishing (CMP) slurries that are expected to come to market next year.
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| BASF and Evonik will develop ceria-based CMP slurries. |
Iordanis Savvopoulos, vice president of technology solutions in Evonik´s inorganic materials unit, said that as scaling proceeds, “the requirements of the CMP process have become increasingly critical. Evonik and BASF believe that this project will enable both parties to stay ahead in CMP technology and provide next-generation solutions and materials for the IC industry.”
Klemens Mathauer, director of the CMP business at BASF Electronic Materials, said the collaboration will combine BASF’s “extensive background in chemistry and long years of experience in the IC industry with the expertise of Evonik in abrasive particles.”
The partners will focus on slurries to planarize both the shallow trench isolation (STI) regions — a fast-growing market for CMP — as well as the interlayer dielectrics (ILDs) in the metallization layers.
Evonik has real estate, energy and specialty chemical business units, with a total of 14.4 billion euros (US$21.6B) in fiscal 2007 revenues. BASF posted sales of almost 58 billion euros (US$87B) in 2007.
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